Promotion videoIntroduction
Microfluidic chipMicrofluidic chip bonded by less elution tape
Micro plateAdhesive tape for bonding micro plate
Micro laser processingMicrofabrication
Business lineup
Precisive punching processing for tape and film
We have several press machines of precisive punching processing for tape and film and we have plotter machine for prototype without mold cost. Also we can punch printed rolled film precisely by continuous press machine with CCD camera. In case of complicated design, it is possible to punch multiply by precisive alignment. Our processing in clean room can meet particle and dust requirement.
Micro laser processing for tape, film and metal foils
Our introduced laser processing with 5 types of wavelength makes possible micro holes and shapes that are impossible by punching processing. It is possible to make micro figures on high cost materials with focus on high volume manufacturing. And also hybrid processing is available such as micro area by laser and other area by punching for achieving target cost at high volume manufacturing.
Bonding process in clean condition
It is possible to bond processed tapes and films precisely with no air bubble. We bond processed tapes and films by our designed fixture with adjusting actual their dimensions. Therefore we can achieve +/- 0.05mm tolerance by simple fixture and continuous bonding process is possible by our automatic machine.
Specific shipping tray in house
We can design and manufacture shipping trays ourselves. Especially specific tray is required for bonded products because of quality maintenance during delivery. It is possible to deliver our products to customers securely with our designed specific tray that meets required product property.
Business policy
We continue to challenge customers' hard demand for both prototype and high-volume production of tape and film.
In R&D of healthcare and chemical field, parts for automobile and various industrial field and electronic components field, precisive punching processing of double-stick tape and film is required. Our tape and film processing is rapidly required high functionality and high quality in order to be embedded in high reliability products. We have enough technology and manufacturing capability that can respond customers’ high level demand for their product development.
Company Profile
Company name | CSTEC Corporation |
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Incorporation | October 20th, 1999 |
Capitalization |
JPY 30,000,000 |
President & CEO |
Yoshitaka Taniguchi |
Banks |
MUFG Bank, Ltd. |
Scope of business |
Precision processing and assembly provider for medical and industrial products |
Sales area |
Japan, North America, Europe |
Regular holiday |
Saturday, Sunday, National Holiday |
Business hours |
8:30 am to 5:00 pm as Japan time |
Location of Head Quarters |
57-1 Ogahara, Makishimacho, Uji Shi, Kyoto Fu, 611-0041, Japan |
Location of 2nd Factory |
35-29-3 Makishimacho, Uji-shi, Kyoto 611-0041 Japan |
Location of Gifu Factory |
3-110 Heijima,Ginan-cho, Hashima-Gun,Gifu 501-6003 Japan |
Yokohama Satelite |
Landmark Plaza 5F,2-2-1 Minatomirai, Nishi-ku,Yokohama City, Kanagawa 220-0012 |
Location of Associated company |
CSCRIE CORPORATION CSKT LIMITED |
Company History
1999 | Established CSTEC, LLC |
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2000 | Launched tray business |
2001 | Changed the company name to CSTEC Corporation |
2002 | Relocated Head Quarters |
2003 | Launched assembly business |
2005 | Opened Hong Kong office |
2006 | Obtained ISO9001 certification and launched clean room |
2007 | Opened Tokyo office |
2009 | Launched e-commerce site |
2014 | Launched special laser processing in Kobe R&D center |
2015 | Obtained KES Environment Management System Standard |
2016 | Opened Uji 2nd factory |
2019 | Relocated Head Quarters |
2020 | Established CSCRIE CORPORATION |
2020 | Relocated Tokyo office |
2021 | Obtained ISO14001 certification |
2021 | Opened Gifu factory |
2024 | Opened USA office |